Patents in subclass Electric Heating/By Microbonding
Parent class: Electric Heating
| Number | Patent title | Issue Date |
|---|---|---|
| 07126078 | Sub-micron adjustable mount for supporting a component and method An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip to a selected welding environment for... |
10/24/2006 |
| 07036225 | Process for treating coil end upon winding of coil A process for treating a coil end is provided, by which upon automatic winding of the coil, an electric connection between a portion of a wire at the front or rear end of the coil and a terminal of a winding object by arc welding can be... |
05/02/2006 |
| 06936785 | Welding construction and a welding method using the same A welding construction (10) includes a weldable portion (11a) formed by bending a leading end of an electrically conductive plate (11). This weldable portion (11a) is formed with a tip (11c). Further, a slit (11d) is formed to extend from... |
08/30/2005 |
| 06898849 | Method for controlling wire balls in electronic bonding A method for forming a substantially spherical free air ball on a fine non-oxidizable wire in a computerized bonder, which has a computerized flame-off (EFO) apparatus operable to generate pulses of different heights and widths. A train... |
05/31/2005 |
| 06896170 | Wire bonder for ball bonding insulated wire and method of using same A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire... |
05/24/2005 |
| 06857552 | Method and apparatus for making smart card solder contacts A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with... |
02/22/2005 |
| 06818861 | Discharge electrode for a wire bonding apparatus A straight rod form discharge electrode used in a wire bonding apparatus. The electrode core material is covered, except for its tip end, by an alumina film that has been subjected to a pore sealing treatment. The alumina film subjected... |
11/16/2004 |
| 06784394 | Ball formation method and ball forming device used in a wire bonding apparatus A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends out of a lower end of a capillary so as to... |
08/31/2004 |
| 06770833 | Micro-welding electrode A micro-welding electrode which is installed in a welding machine and applied to the electronics industry and spot electric welding industry. The micro-welding electrode includes two integrated electrodes which are made from... |
08/03/2004 |
| 06737603 | SW micro welder for directly welding enameled wires This invention deals with a spot electrical welding machine which is technically applied to the electronics industry and micro-electronic industry. A spot electrical welder optimally directly welds enameled wires, fine wires or relevant... |
05/18/2004 |
| 06715658 | Ultra fine pitch capillary A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with... |
04/06/2004 |
| 6671952 | Method of lead wire connection A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member against the upper surface of the land portion... |
01/06/2004 |
| 06671952 | Method of lead wire connection A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member against the upper surface of the land portion... |
01/06/2004 |
| 06660956 | Method of and apparatus for monitoring a ball forming process A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The... |
12/09/2003 |
| 06552293 | Metallic members joining method and reflow soldering method In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an... |
04/22/2003 |
| 06520399 | Thermosonic bonding apparatus, tool, and method A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm interconnecting the bonding tool and the... |
02/18/2003 |
| 06495787 | Electrical connection system between an electrochemical cell and a printed circuit An electrical connection system between an electrochemical cell and a printed circuit having a copper layer, the system comprising at least one connection piece welded to the cell, wherein the layer of copper is of a thickness greater... |
12/17/2002 |
| 06491203 | Wire bonding apparatus A wire bonding apparatus equipped with a capillary through which a wire is passed, a torch electrode which is installed in a substantially horizontally movable manner so as to be positioned beneath the capillary, and a torch electrode... |
12/10/2002 |
| 06354479 | Dissipative ceramic bonding tip Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present invention, to avoid damaging delicate... |
03/12/2002 |
| 06337453 | Method and apparatus for arc-forming a bonding wire ball with attenuated electro-magnetic interference An improved apparatus and method for forming a fusion ball at the end of a wire protruding from an ultrasonic bonding tool preparatory to making a ball bond to a workpiece includes shielding means for attenuating electromagnetic... |
01/08/2002 |
| 06215083 | Welded wire termination device and method A welded wire termination for use in thermally and mechanically stressful environments is provided by forming a wire termination tab on a conductive pad to define a tubule for receiving a wire, either stranded or solid. The tubule is... |
04/10/2001 |
| 06198064 | Terminal for electric wire welding and welding torch suitable for electric wire welding to the terminal A pad piece is unitedly formed on a wrapping terminal to be contacted by an electrode probe and positioned to be opposed to a welding torch, and the electrode probe is held by the welding torch to approach a wrapping terminal, whereby the... |
03/06/2001 |
| 06172318 | Base for wire bond checking A base mainly includes a heating plate and a probe. The probe is attached to the surface of a heating plate which serves to place a substrate having an ball pad on a lower surface facing the probe of the heating plate. The probe contacts... |
01/09/2001 |
| 6156990 | Long-wearing impervious conductive wire clamp A wire bonding machine having a wire clamp comprised of a platinum group metal such as iridium, rhodium, ruthenium, or osmium so as to minimize corrosion due to micro sparking. |
12/05/2000 |
| 6137075 | Method and apparatus for producing an electrical bond between conductors and electrical connector contacts A method and apparatus for producing an electrical bond between a conductor and an electrical connector contact. The apparatus generally comprises a power source and a weld head. The power source has a first polarity output and a second... |
10/24/2000 |
| 6112973 | Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated... |
09/05/2000 |
| 6112974 | Wire bonding method A wire bonding method comprising the steps of raising a capillary after bonding a ball formed on the tip end of the wire extending from the tip end of a capillary to a first bonding point, moving the capillary to a position located at an... |
09/05/2000 |
| 6062462 | Apparatus and method for making predetermined fine wire ball sizes A method and apparatus for making small ball size ratio air balls for use with fine pitch bonding tools includes programming an automatic wire bonder to make a predetermined diameter ball on a fine wire. The predetermined ball size, the... |
05/16/2000 |
| 6064026 | Method for producing an electrical bond between conductors and electrical connector contacts A method for producing an electrical bond between a contact element of an electrical connector and a conductor, the contact element having a portion that is bifurcated such that the conductor is positioned between the furcations, the... |
05/16/2000 |
| 5988482 | Discharge abnormality detection device and method for use in wire bonding apparatus A device and method is available for detecting abnormalities of an electric discharge generated for forming a ball at the end of a bonding wire in a bonding apparatus. A high voltage is applied across the bonding wire and an electrode,... |
11/23/1999 |
| 5957371 | Method and apparatus for forming a ball in wire bonding In a fixed type discharge electrode system employed for forming a ball on a bonding wire, a magnet is provided on, for instance, the discharge electrode so as to apply a magnetic field that causes the portion of an electric spark facing... |
09/28/1999 |
| 5894982 | Connecting apparatus A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool... |
04/20/1999 |
| 5797388 | Wire-bonding apparatus and method using a covered wire In a wire-bonding machine and method that uses a covered wire, discharge electrodes comprise a pair of discharge electrodes for covering-film removal, in which the upper and lower surfaces of electromagnetic parts used as discharge... |
08/25/1998 |
| 5763849 | Wire bonding apparatus In a wire bonding apparatus comprising a torch electrode for melting an end of a metallic thin wire to form a ball thereof, a high voltage detecting circuit for detecting a voltage between the metallic thin wire and the torch electrode in... |
06/09/1998 |
| 5676856 | Electric discharge apparatus for cleaning electrode on workpiece and method thereof A voltage is applied between a first cleaning electrode that in contact with an electrode on a workpiece such as a printed circuit board or a chip, and a second cleaning electrode located in the vicinity of the electrode on the workpiece,... |
10/14/1997 |
| 5616257 | Wire bonding method and apparatus An electrode used in a wire bonding method and apparatus for applying an electric discharge to an end of a bonding wire so as to form a ball at the end of the bonding wire. The electrode is provided with an obliquely cut surface at one... |
04/01/1997 |
| 5601740 | Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the... |
02/11/1997 |