Patents in subclass Electric Heating/By Use Of A Bridging Member (E.G., Splice Plate)

Number	Patent title	Issue Date
06206273	Structures and processes to create a desired probetip contact geometry on a wafer test probe The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of...	03/27/2001
06188039	Projection welded panel spacer and method for making the same A method for making a spacer assembly comprises: forming a plurality of projections along an edge of a portion of sheet metal; roll forming the portion of sheet metal into a tubular configuration; positioning the roll formed portion of...	02/13/2001